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Solder paste AP-10, Bi57Sn42Ag1

Solder paste NO-CLEAN, lead-free, metal content 88 %, alloy Bi57Sn42Ag1, grain size T3, melting range: 137°C-139°C
Item no.WL83324
ManufacturerTAMURA ELSOLD
Manufacturer article no.LOTPAST0043
Sales unit1 cans
Content unit1 cans
Lead-free/lead-containinglead free
Metal content88 %
GPSR manufacturer dataTAMURA DEUTSCHLAND GmbH
Hüttenstraße 1
DE-38871 Ilsenburg
www.tamura-elsold.de
Price on request

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Item No.WL83324