ESD desoldering braid Soder-Wick®, halogen-free

Soder-Wick® No Clean desoldering braid was developed to enable fast and safe desoldering without leaving harmful flux residues.

Soder-Wick® No Clean desoldering braid uses pure, oxygen-free copper braid and patented flux technology to produce an efficient and effective desoldering braid. Soder-Wick® No Clean desoldering braid is available on ESD-safe spools to prevent damage from static electricity.

The entire braid is sealed in a nitrogen purged package to prevent corrosion and loss of performance due to moisture and oxygen.

Features and benefits
• Soder-Wick® No Clean packaged in ESD-safe, static dissipative coils
• Minimizes the risk of damage from static electricity
• Patented, non-corrosive, halogen-free, organic no-clean flux
• Desolders up to 40% faster than comparable no-clean solder braids and leaves cleaner PCBs
• Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance
Applications
• Soder-Wick® No Clean SD safely removes solder in all applications requiring ROL0 type fluxes
• BGA solder wire specifically designed for rework/repair of BGA pads and chips, allowing all BGA pads to be cleaned in three to four passes
Specifications
• MIL-F-14256 F
• NASA-STD-8739.3 Soldered electrical connections
• DOD-STD-883E, Method 2022
• ANSI/IPC J STD-004, Type ROL0
• Complies with MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
• Meets the solderability parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR)