ESD desoldering braid Soder-Wick®, lead-free

Soder-Wick® lead-free desoldering tape is the state of the art in desoldering technology. It has been specially developed for the removal of modern lead-free high-temperature solders. The single-ply fabric of Soder-Wick® lead-free desoldering tape is lighter than any other desoldering tape available and allows the removal of lead-free solder at lower temperatures. Soder-Wick® lead-free desoldering tape responds faster than any other conventional desoldering tape. This unique design minimizes overheating and requires less "contact time", preventing heat damage to the circuit board and sensitive components. For lead-free rework, Soder-Wick® is the right solution.

All solder wires are sealed in nitrogen-purged packaging to prevent corrosion and loss of performance due to moisture and oxygen.

Features and benefits
• Specially developed for high temperature lead-free solders
• Conducts heat to the solder joint faster and more efficiently than conventional desoldering braids
• Specially developed for all lead-free solders
• Can also be used with tin/lead solders
• Soder-Wick® Lead-Free is packaged in ESD-safe, static dissipative spools
• Minimizes the risk of damage from static electricity
• Non-corrosive, ultra-high purity, clean-free flux.
• Leaves no ionic contamination on circuit boards.
• Particularly effective in removing solder residues from SMT pads.
• RoHS compliant.
• Patent pending.
Applications
• Soder-Wick® Lead Free safely removes solder from all lead-free applications.
Specifications:
• MIL-F-14256 F
• NASA-STD-8739.3 Soldered Electrical Connections
• DOD-STD-883E, Method 2022
• ANSI/IPC J STD-004, Type ROL0